How To Repair Damaged Harness From Stereo To The Battery On A 1963 Buick Riviera

General Troubleshooting Guide

Equipment

DSD TECH SH-U09C5 USB to TTL UART

On the pictured cable (upside down in this pic), you volition only use White, Gray and Purple leads, tape (or glue) them together with White in the center, and the other two on the sides; the other 3 are unused. Yous can either prune the connections of the WGP wires and solder them directly to the board or solder in leads like the ones pictured and then yous can disconnect from the board. Nosotros prefer the connectedness method. On the control board, you will see "R UART T" near the iii console points. RXD GND TXD connects in the reverse lodge, meaning the RXD on the USB adaptor will connect to T on the board, GND will connect to UART, and TXD volition connect to R. If yours is anything like ours, y'all volition have to disconnect the colored cablevision from either the control board or the adaptor Earlier powering the test bench up or information technology will think you take pressed a fundamental interrupt and prevent the board from loading the test file. After about 5 seconds you lot can reconnect it. We have two cables that behave this manner, and two that practise not. Using this with the test bench will allow you to become the report on PUTTY similar any other COM cablevision.

Microscope

Nosotros accept a microscope used to inspect pocket-sized resistors and leads; we have an AmScope with a camera, but you can find cheaper digital ones that work well plenty.

Kester 186 Flux-Pen, CHIPQUIK RMA791 rosin flux container (personal preference)
Lead-Gratis Solder Paste (8oz container or more, MAKE Certain TO KEEP REFRIGERATED and monitor expiration engagement, this stuff volition go bad and will non work)
You accept a proficient oestrus gun and solder iron, consider J-tip attachments for iron.
Set of J-tip tweezers; cantankerous locks are overnice but not necessary.
Spool of solder wick, a width of at to the lowest degree 2mm, 3mm is practiced.
Set of pliers, at least one with needle nose.
Small battery-operated fans for cooling boards during the soldering process.

Diagnosing Bug

Along with this guide, y'all should refer to the manual for S17 diagnostics, other models are slightly unlike, just the theory is the same.

0 ASIC

Usually acquired by a bad ASIC or power failure. Using the RO test point, cheque for i.8V or higher starting from the last fleck (48) to the outset; if yous go a reading of i.5V or less, there is a problem with the ASIC to the LEFT of the point. I.Due east., if the RO between 47 and 46 is reading 1.8V, but between 46 and 45 is reading 0.9V, there is a problem with ASIC 46. If you are getting 1.8V beyond one domain (four chips vertical) but non on another domain, inspect the 5-pivot LDOs on the backside bottom of the board. The everyman one should put out i.8V or college (max of 3.3V) on the bottom left pin, and the other should output 0.8V on the same pin. If these are not working bank check for 3.3V input on the other side of the LDO. If it has 3.3V in but is not outputting correctly, alter the LDO. If you cannot become >1.8V anywhere on the board, and your LDOs are not getting 3.3V in, inspect the "Boost Circuit" (refer to the manual) for damaged capacitors and chips, and make certain the unabridged board is receiving at least xviii.0V in. If the Boost Circuit appears fine and there is eighteen.0V to the board, supervene upon the 24-Pin Motion picture chip designated U3 on the underside of the board near the power terminals. If y'all have gotten this far and it nonetheless has not worked, I am sorry; you lot accept a damaged capacitor on the board, and it is one of the minor ones. You lot will have to expect for burns, or capacitors that have moved from their locations. If nothing appears, you volition have to use a microscope and inspect each capacitor for cracks and fragmentation. These typically occur near the PIC chip where a lot of power flows, or near your test points on the chips.

"X" ASIC

These are very straightforward. If the exam bench reads out "ONLY HAVE 'X' ASIC" more probable than non the bad chip is X+1. For example "Only Take 31 ASIC" would hateful that ASIC 32 needs to exist replaced.

Temp Sensor Lost / Bad Clock Counter / REG_TYPE (Blueprint NG)

All these conditions chronicle to a bad design. Yous will have to use the test bench and discover out which chip is scoring low and replace it. The exception here is the Temp Sensor Lost condition, sometimes this tin be stock-still by cleaning off the temp sensor (oftentimes replacing information technology) and the capacitors near it. More often than not though, an ASIC that is not seated properly will cause a temp sensor loss because the sensors are fed ability FROM the ASIC. Bad Clock Counter you will only meet in the kernel log, it will read something like "BAD CLOCK COUNTER CHAIN 0, ASIC 5" this means that ASIC five is seated improperly and may be repaired simply by reflowing the solder. REG_TYPE errors are related to a bad pattern, SOMETIMES the test bench volition point out what chip caused this problem, other times the test log volition fill up with "REG BUFFER Total." This indicates that more than i ASIC has a bad pattern examination and needs to be replaced. SOMETIMES you can replace the EEPROM storage scrap (designated U6 on S17) and it will solve this problem.

PIC Lost / Heart Crush Fail

These are E'er caused by a Pic fleck failure. If the lath is receiving proper 18.0V and information technology does not work, Replace the 24-pin Movie chip U3. If that does not fix it, inspect the capacitors about the bit.

Replacing ASIC Chips

Bin Numbers

This is the almost important factor to consider. The ASIC chips are compatible between the T17, S17, and the plus models (NOT ENTIRELY Certain Virtually T17E BECAUSE WE DON'T Take ANY) so you tin use them from one-time boards within the same 17 family. Even so, labeled on the boards is a sticker that designates BIN number, this can exist Bin1, 2, 3, or four. You lot MUST apply Bin 2 chips on a Bin two board, in that location is NO compatibility between them. Secondly, but less important, if recycling chips, endeavour to utilize boards that pass at a similar blueprint level; this is designated by the sticker "L1, L2, L3 … L8" When purchasing ASIC chips online, exist careful and identify the BIN number you are purchasing and mark the purse they come up in as soon every bit you get them. There is NO Way to identify bin number by looking at the chip. (I am lamentable nigh the curl y'all guys have; it may exist useless unless you can find that info.)

Removal

Remove the heatsinks from the elevation and lesser of the flake (480 degrees, 50% fan) do not utilise pressure to the heatsinks or you lot will harm the chip, they should come up correct off. Use flux pen to the leads of the ASIC, and some to the lesser (yous tin run into air holes underneath) Rut the chip (460 degrees, 25% - 30% fan) directly above (one-ii inches) until you meet the solder flow While heating, accept J-tip tweezers on the NON-contact edges of the ASIC and pick it direct upwards. Once more, not too much pressure, when it is heated enough it volition come correct up. Otherwise, you will damage the scrap or PCB. Pick the chip Directly UP as best yous can, or you risk bridging the contacts with solder or knocking a capacitor out of identify. If the chip does non come off later iii minutes of estrus, information technology may be fused to the PCB; this happens when a scrap gets also hot or receives too much current. By this signal, you may see the scrap starting to crack or parts of it coming off. Unfortunately, at that place is no way to save the PCB once this happens, the internal circuitry is damaged. The proficient news about this is that most of the other components on the board are reusable then you will take gained a skillful parts board.

Placing

Starting time, inspect the socket and chip for any solder bridges or areas with low solder. Clear any bridges and employ the new paste to areas that need it, rut the new solder until it tins. Check the main pad areas of the socket and fleck for high spots and clear them using the solder fe and wick, or the chip volition non sit apartment. Apply a generous amount of flux to the flake and socket, and double-check your orientation. I like to hold the chip in place with the tweezer first, apply a short burst of heat until the solder begins to period, I telephone call this tacking. Remove rut and tweezers and the chip should sit where you were property it. Employ more than flux if needed and apply heat directly above the chip (460 degrees, 25% fan) until the chip sits down, y'all volition see the solder flow onto the contacts around the flake. Y'all may have to apply GENTLE downward force per unit area to the flake to seat it properly. If you see any contacts that look bare, employ a small corporeality of pressure to that area during heating. Once placed, allow the board to absurd using a battery-operated fan or sit down it on the tester with the fans on. Cheque your examination points (attached documentation) for their proper readings, if they are good you can run the lath on the tester, Simply But ALLOW IT TO Exercise ASIC COUNT. You can toggle which style the test runs in the config.ini file on the testing SD card. Alternatively, you tin can run it until the "nonce" value on the footling screen changes from 0. (If you have the panel cable hooked up yous can encounter where information technology will read how many ASICs it sees). TURN OFF THE BENCH ONCE Information technology BEGINS THE PATTERN Test. If yous have non reapplied the heatsinks the lath Volition overheat and give you a bad pattern result or burnout. If your board is at present reading all its ASICs (or a different flake is bad at present) y'all can reattach the heatsinks to the pinnacle and bottom of the chip. Utilize 480-degree estrus, 30% fan above the heatsink and apply NO PRESSURE, the heatsink will seat itself when it is hot enough. Side by side, run the blueprint test; if everything went well your chip should render a good pattern result. Otherwise, yous may need to apply more estrus to the bit, reseat it, or supervene upon it once more. If information technology passes the pattern exam with no issues, the board is ready to put into a miner and run.

Good Luck!

Source: https://eastcoastmining.repair/general-troubleshooting-guide/

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